Features
- Qualified Bluetooth® v5.1 specification
- 120MHz Qualcomm® Kalimba™ audio DSP
- 32MHz developer processor for applications
- Firmware Processor for system
- Flexible QSPI flash programmable platform
- High-performance 24‑bit stereo audio interface
- Digital and analog microphone interfaces
- Flexible PIO controller and LED pins with PWM support
- Supports UART, Bit Serializer (I²C/SPI), and USB 2.0 serial interfaces
- Advanced audio algorithms
- 1 or 2-mic Qualcomm@ cVc™ headset noise reduction and echo cancellation technology
- Supports Qualcomm@ broadcast audio technology technology
- Supports SBC and AAC audio codecs
- Integrated PMU with dual SMPS for system/digital circuits and integrated Li-ion battery charger
Applications
- Bluetooth Stereo Headsets
Specifications
| Bluetooth Audio Module | FSC-BT1026C |
|---|---|
| Chipset | Qualcomm QCC3024 |
| Bluetooth Standard | Dual-mode Bluetooth 5.1 |
| Size (mm) | 13 × 26.9 × 2.2 |
| Transmit Output Power | +9 dBm (Max.) |
| Profiles | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
| Certification | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
| Frequency Band | 2.402~2.480GHz |
| Audio Codecs | SBC, AAC |
| Operating Temperature | -40 °C to +85 °C |
| Storage Temperature | -40 °C to +85 °C |
Firmware
| Firmware No. | Application | Profiles |
|---|---|---|
| FSC-BT1026C | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio (TWS) & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio & Data | Customization |
