- General Features
- IEEE 802.11 a/b/g/n/ac radio with virtual-simultaneous dual-band operation
- Provides a highly integrated WLAN system-on-chip (SoC) for 5GHz 802.11ac, or 2.4GHz/5GHz 802.11n WLAN applications
- Supports BT 5.0 + HS, BLE and ANT+ and backward compatibility with BT 1.x and BT 2.x + Enhanced Data Rate
- Supports a single-ended RF port for cleaner and lower cost design
- Supports 20MHz/40MHz at 2.4GHz and supports 20MHz, 40MHz, or 80MHz at 5GHz
- Supports BT_WLAN coexistence and ISM-LTE coexistence
- Operates on one 3.3-volt power supply and an I/O supply of 1.8V or 3.3V. Both WLAN and BT power management use advanced power-saving techniques such as:
- Gating clocks to idle or inactive blocks
- Voltage scaling to specific blocks in certain states
- Fast start and settling circuits reduce TX
- Active duty cycles
- Processor frequency scaling
- Other techniques to optimize power consumption across all operating states
- Includes additional features such as:
- Low-density parity check (LDPC)
- 1.5Kb of Module one-time programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and BOM cost
- Supports BT for Class 1 and Class 2 power-level transmissions without requiring an external PA
- Module WLAN driver execution capable of supporting IEEE 802.11 functionality
- WLAN host interface options
- Low power SDIO 3.0 / SDIO 2.0 interface for WLAN and UART/PCM interface for BT
- BT host digital interface (which can be used concurrently with the below interface)
- UART (Max Baud Rate 3.2 Mbps)
- Single-ended RF port for cleaner and low-cost design
- 20/40MHz at 2.4GHz and 20/40/80MHz at 5GHz
- PCM for BT audio
- Stamp module suitable for Surface Mounted Technology (SMT)
- Iron Shielding case
- Stamp-56 package
- Dimensions (Iron Shielding Case): 17mm (L) × 17mm (W) × 2.4mm (H)
- Operating Voltage: VDD_3V3_WL (3.14 to 3.46V); VDD_IO (1.71 to 3.46V)
- RoHS / REACH Compliant
- Industry Level
- Bluetooth Features
- Bluetooth V5.0, and is backwards compatible with BT 1.x, 2.x + EDR, BT 3.x and BT 4.0
- BT for Class 1 and Class 2 power-level transmissions without requiring an external PA
- UART (Max Baud Rate 3.2Mbps)
- PCM for BT audio
- WLAN Features
- IEEE 802.11ac compliant (Support WPA, WPA2/WPA3)
- Single-stream spatial multiplexing up to 433.3 Mbps data rate
- Supports 20, 40, and 80 MHz channels with optional SGI (256 QAM modulation)
- Full IEEE 802.11 a/b/g/n legacy compatibility with enhanced performance
- Low power SDIO 3.0 / SDIO 2.0 interface for WLAN
Applications
- Internet-of-Things (IoT) Applications, including:
- Home and Building Automation
- Low-Power Video Cameras
- Thermostats
- Access Control and Electronic Locks (E-Locks)
- Asset Tracking and Real Time Location System (RTLS) Tags
- Cloud Connectivity
- Internet Gateway
- Appliances
- Security Systems
- Smart Energy
- Industrial Control
- Smart Plug and Metering
- Wireless Audio
- IP Network Sensor Nodes
- Medical Devices
- Car audio and video system
Specifications
| Categories | Features | Implementation |
|---|---|---|
| Bluetooth | ||
| Bluetooth Standard | Bluetooth V5.0 + EDR | |
| Frequency Band | 2.402 ~ 2.480 GHz | |
| Interfaces | UART, PCM | |
| Wi-Fi | ||
| Frequency Band | 2.412 ~ 2.484 GHz / 4.900 ~ 5.925 GHz | |
| Interface | SDIO | |
| General | ||
| Dimensions (mm) | 17 × 17 × 2.4 | |
| Operating Temperature | -40°C ~ +85°C | |
| Storage Temperature | -40°C ~ +85°C | |
| VDD_3V3_WL | 3.3V (Typ.) | |
| VDD_IO | 1.8V ~ 3.3V (Typ.) | |
| Miscellaneous | Lead Free | Lead-free and RoHS compliant |
| Warranty | One Year | |
| Humidity | 10% ~ 90% non-condensing | |
| MSL grade: | MSL 3 | |
| ESD grade: | Human Body Model: Pass ±2000V, all pins Charge device model: Pass ±400V, all pins |
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