Likaroloana
- Litlhaloso tse tšoanelehang tsa Bluetooth® v5.1
- 120MHz Qualcomm® Kalimba™ audio DSP
- 32MHz developer processor bakeng sa lits'ebetso
- Firmware processor bakeng sa sistimi
- Flexible QSPI flash programmable platform
- Sehokelo sa audio sa stereo se sebetsang hantle sa 24-bit
- Khokahano ea maekerofounu ea dijithale le analoge
- Selaoli se bonolo sa PIO le lithakhisa tsa LED tse nang le tšehetso ea PWM
- E tšehetsa UART, Bit Serializer (I2C/SPI), le li-interface tsa serial tsa USB 2.0
- Mekhoa e tsoetseng pele ea molumo
- 1 kapa 2-mic Qualcomm@ cVc™ ea ho fokotsa lerata le theknoloji ea ho hlakola echo
- E ts'ehetsa mahlale a theknoloji ea audio ea Qualcomm@ broadcast
- E tšehetsa SBC le AAC audio codecs
- PMU e kopantsoeng e nang le li-SMPS tse peli bakeng sa li-circuits tsa tsamaiso / digital le tjhaja e kopantsoeng ea Li-ion ea betri
Lisebelisoa
- Li-headphone tsa Bluetooth tsa Stereo
songolo
| Bluetooth Audio Module | FSC-BT1026C |
|---|---|
| Chipset | Tlhaloso ea Qualcomm QCC3024 |
| Bluetooth standard | Bluetooth ea mefuta e 'meli ea 5.1 |
| Boima (mm) | Li-13 × 26.9 × 2.2 |
| Fetisetsa khumo Power | +9 dBm (Boholo.) |
| Litlaleho | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
| tiiseletswe | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
| maqhubu Band | 2.402 ~ 2.480GHz |
| Codecs tsa Audio | SBC, Aac |
| bueloang Mocheso | -40 ° C ho +85 ° C |
| Storage Mocheso | -40 ° C ho +85 ° C |
Firmware
| Firmware No. | kopo | Litlaleho |
|---|---|---|
| FSC-BT1026C | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio (TWS) & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio & Data | Tlhophiso |
