Features
- Fa'amatalaga agavaa Bluetooth® v5.1
- 120MHz Qualcomm® Kalimba™ leo DSP
- 32MHz developer processor mo talosaga
- Firmware Processor mo faiga
- Fesuia'i QSPI flash platformmable platform
- Fa'atonuga maualuga 24-bit leo fa'alogo leo
- Feso'ota'iga fa'akomupiuta fa'atekinolosi ma analog
- Fa'atonu PIO ma pine fa'apipi'i fa'atasi ma le lagolago PWM
- Lagolago UART, Bit Serializer (I2C/SPI), ma USB 2.0 feso'ota'iga fa'asologa
- Algoritimi fa'alogo fa'apitoa
- 1 po'o le 2-mic Qualcomm@cVc™ fa'aitiitiga pisa leo ma fa'aleaogaina tekinolosi
- Lagolago Qualcomm@ faʻasalalauga tekonolosi tekonolosi
- Lagolago SBC ma AAC leo codecs
- PMU tu'ufa'atasi ma SMPS lua mo komipiuta fa'akomepiuta ma feso'ota'iga Li-ion uta maa
Talosaga
- Bluetooth Stereo Headsets
auiliili
| Bluetooth Audio Module | FSC-BT1026C |
|---|---|
| Chipset | Qualcomm QCC3024 |
| Faʻataonia le Bluetooth | Lua-faiga Bluetooth 5.1 |
| Toa (mm) | 13 × 26.9 × 2.2 |
| Tuuina atu Malosiaga | +9 dBm (Max.) |
| Fa'amatalaga | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
| faʻamaoniga | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
| vaega faafia | 2.402 ~ 2.480GHz |
| Audio Codecs | SBC, AAC |
| vevela o Gaoioiga | -40 ° C i le +85 ° C |
| teuina o Meaai a le vevela | -40 ° C i le +85 ° C |
Faamaumauga
| Firmware Nu. | talosaga | Fa'amatalaga |
|---|---|---|
| FSC-BT1026C | Leo & Fa'amaumauga | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Leo (TWS) & Fa'amaumauga | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Leo & Fa'amaumauga | Customization |
