Main Features
- Thandizani Bluetooth V4.2
- Thandizani mbiri ya Bluetooth: SPP, HID, GATT, ATT, GAP
- Thandizani Apple MFi (iAP2), iBeacon
- Kuthandizira 802.11 b/g/n,802.11 n (2.4GHz) liwiro mpaka 150 Mbps
- Support Stamp module yoyenera Surface MountedTechnology (SMT)
- Thandizani lron Shielding kesi (Mwasankha), RoHS / REACH Yogwirizana, Mlongoti Wakunja
- Dimension(Lron Shielding Case): 22.9mm(L)x21.9mm(W) x 2.0mm(H)
chizindikiro Basic
Mawonekedwe | |
Nthawi zambiri ntchito: | 902-928MHz |
Kukhudzika kwa kuwerenga ndi kulemba: | -12dB (angafikire mtunda wowerenga wa mamita oposa 5) |
Chip: | Monza R6 |
Werengani ndi kulemba protocol: | ISO 18000-6C, EPC C1Gen2 |
ntchito; | werengani / lembani |
Chip Features | |
EPC : | Chithunzi cha 96EPC |
Chip memory: | palibe |
TID: | 48 biti |
Lowetsani mawu achinsinsi: | palibe |
Kupha mawu achinsinsi: | palibe |
Nthawi yosungira deta: | zaka 10 |
Nthawi zolembedwanso: | 100,000 nthawi |
Thupi katundu | |
Kukula Kwathupi (WxLxH): | 98mm x 56mm x 5mm |
Zinthu za Shell: | ABS |
mtundu; | White |
kulemera kwake: | 50g |
Njira yoyika: | kusokoneza |
Gwiritsani ntchito chilengedwe | |
Mlingo wa chitetezo: | IP65 |
Kutentha kwa ntchito: | -40ºC mpaka +85ºC |
Mapulogalamu: | Kampasi, kasamalidwe ka ogwira ntchito m'chipatala, etc |
Mapulogalamu
Kumasulira
Type | Title | Date |
---|---|---|
Tsamba lazambiri | Chithunzi cha FSC-RT031-PCBDatasheet-V2.3.pdf | April 6, 2022 |