Features
- secundum quid Bluetooth® v5.1 specificationem
- 120MHz Qualcomm® Kalimba™ audio DSP
- 32MHz elit processus applicationes
- Firmware Processor ad systema
- Flexibile QSPI mico programmabilis suggestus
- Summus perficientur 24‑bit mono audio interface
- Digital and analog microphone interfaces
- Flexibile PIO moderatoris ac paxillos cum PWM auxilio DUXERIT
- Sustinet UART, Bit Serializer (I2C/SPI), et USB 2.0 Vide interfaces
- Provectus audio algorithms
- 1 vel 2-mic Qualcomm@ cVc™ tincidunt sonitus reductionis et vocis novae technology
- Sustinet Qualcomm@iaci technologiae audio
- Sustinet SBC et AAC codecs audio
- Integrated PMU cum duali SMPS pro systema / circuli digitalis et integralis Li-ion patina altilium
applications
- Bluetooth Stereo Headsets
Specifications
| Bluetooth Audio OMNIBUS | FSC-BT1026C |
|---|---|
| chipset | Qualcomm QCC3024 |
| Latin Bluetooth | Dual-modus Bluetooth 5.1 |
| Magnitudine (mm) | 13 × × 26.9 2.2 |
| Transmittunt Output Power | +9 dBm (Max.) |
| profiles | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
| certificatione | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
| Band frequency | 2.402 ~ 2.480GHz |
| audio Codecs | SBC, AAC |
| Operating Temperature | -40 85 ° C ad F + |
| Calor PRAECLUSIO | -40 85 ° C ad F + |
firmware
| Firmware No. | Applicatio | profiles |
|---|---|---|
| FSC-BT1026C | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA . |
| FSC-BT1026C | Audio (TWS) & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA . |
| FSC-BT1026C | Audio & Data | Aliquam |
