Kav hlau txais xov Design
1. Pub noj
2. Cov cim cim
3. Soldering davhlau ya nyob twg
nta
1. Nto Mounted Devices nrog ib tug me me dimension ntawm 5.2 x 2.0 x 1.1 mm raws li yav tom ntej miniaturization sib.
2. Embedded thiab LTCC (Low Temperature Co-fired Ceramic) thev naus laus zis tuaj yeem ua rau yav tom ntej nrog kev tsim qauv thiab ua kom zoo nkauj lub tsev ntawm cov khoom kawg.
3. Kev ruaj ntseg siab hauv qhov kub thiab txias hloov pauv
daim ntawv sau npe
Bluetooth thiab Wireless LAN
HormRF
ISM band 2.4GHz wireless daim ntawv thov
