FSC-BT1026A Qualcomm QCC3021 Bluetooth 5.1 TWS Audio SoC Module for Wireless Speakers

Pawg:
FSC-BT1026A

Lub Feasycom FSC-BT1026A yog dual-mode Bluetooth 5.1 TWS suab SoC module raws li Qualcomm QCC3021 chipset uas muaj qhov hloov tau yooj yim flash programmable platform thiab qis zog rau lub neej ntev roj teeb. Tsim los rau high-end aptX audio applications, FSC-BT1026A Bluetooth audio module txhawb nqa A2DP, AVRCP, HFP, HSP, SPP, GATT, HOGP, thiab PBAP cov ntaub ntawv, nrog rau SBC thiab AAC cov lej suab.

nta

  • Tsim nyog Bluetooth® v5.1 specification
  • 120MHz Qualcomm® Kalimba™ audio DSP
  • 32MHz tus tsim tawm processor rau kev siv
  • Firmware Processor rau qhov system
  • Yooj yim QSPI flash programmable platform
  • High-performance 24-ntsis tso suab suab interface
  • Digital thiab analog microphone interfaces
  • Hloov pauv PIO maub los thiab LED pins nrog PWM txhawb nqa
  • Txhawb UART, Bit Serializer (I2C/SPI), thiab USB 2.0 serial interfaces
  • Advanced audio algorithms
  • 1-mic Qualcomm @ cVc ™ hais lus suab nrov txo thiab ncha tshem tawm tshuab
  • Txhawb Qualcomm @ TrueWireless ™ thev naus laus zis thiab TrueWireless ™ Stereo Plus thev naus laus zis
  • Txhawb SBC thiab AAC suab codecs
  • Integrated PMU nrog dual SMPS rau qhov system / digital circuits thiab integrated Li-ion roj teeb charger

Cov ntawv thov

  • Bluetooth hais lus wireless

Specifications

Bluetooth Module FSC-BT1026A
chipset Txuj Ci QCC3021
Bluetooth Txuj Ci Dual-mode Bluetooth 5.1
Loj (hli) 13 × 26.9 × 2.2
Hloov cov zis fais fab + 9 dBm (Max.)
Profiles A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT
lawm CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC
zaus Band 2.402 ~ 2.480GHz
Lub suab Codecs SBC, AW
Kev khiav hauj lwm Kub -40 ° C txog +85 ° C
cia Kub -40 ° C txog +85 ° C

firmware

Firmware No. Daim ntawv thov Profiles
FSC-BT1026A Audio & Data HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA
FSC-BT1026A Audio & Data customization

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