ʻOi aku ka koʻikoʻi o nā kūlana maikaʻi o nā huahana uila automotive ma mua o nā mea uila uila maʻamau. ʻO AEC-Q100 kahi maʻamau i hoʻomohala ʻia e ka Automotive Electronics Council (AEC). Ua paʻi mua ʻia ʻo AEC-Q100 ma Iune 1994. Ma hope o ʻumi mau makahiki o ka hoʻomohala ʻana, ua lilo ʻo AEC-Q100 i mea maʻamau no nā ʻōnaehana uila kaʻa.
He aha ka AEC-Q100?
ʻO ka AEC-Q100 ka mea nui o nā kūlana hoʻāʻo koʻikoʻi i hoʻolālā ʻia no nā huahana kaapuni i hoʻohui ʻia no nā noi kaʻa. He mea koʻikoʻi kēia kikoʻī no ka hoʻomaikaʻi ʻana i ka hilinaʻi huahana a me ka hōʻoia maikaʻi. ʻO ka AEC-Q100 ka mea e pale aku ai i nā kūlana like ʻole a i ʻole ka hiki ʻole ke hāʻule, a hōʻoia paʻa i ka maikaʻi a me ka hilinaʻi o kēlā me kēia chip, ʻoi aku hoʻi no ka hoʻāʻo maʻamau o nā hana huahana a me ka hana.
He aha nā hoʻokolohua i hoʻokomo ʻia i ka AEC-Q100?
ʻO ka kikoʻī AEC-Q100 he 7 mau ʻāpana a he 41 mau hōʻike.
- Pūʻulu A-ACCELERATED ENVIRONMENT STRESS TESTS, he 6 mau hoʻokolohua, me: PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL.
- ʻO ka hui B-ACCELERATED LIFETIME SIMULATION TESTS, he 3 mau hoʻokolohua, me: HTOL, ELFR, EDR.
- Nā ho'āʻo hoʻāʻo ʻo C-PACKAGE ASSEMBLY INTEGRITY, ka huina o 6 mau hoʻokolohua, me: WBS, WBP, SD, PD, SBS, LI.
- ʻO ka hui D-DIE FABRICATION RELIABILITY TESTS, he 5 mau ho'āʻo, me: EM, TDDB, HCI, NBTI, SM.
- Group E-ELECTRICAL VERIFICATION TESTS, he 11 mau ho'āʻo, me: TEST, FG, HBM/MM, CDM, LU, ED, CHAR, GL, EMC, SC, SER.
- Pūʻulu F-DEFECT SCREENING TESTS, he 11 mau hoʻokolohua, me: PAT, SBA.
- Pūʻulu G-CAVITY PACKAGE INTEGRITY TESTS, he 8 mau hoʻokolohua, me: MS, VFV, CA, GFL, DROP, LT, DS, IWV.
Manaʻo ʻia nā modula Bluetooth/Wi-Fi pae Automotive e hoʻohana i nā chipsets kūpono AEC-Q100.
BLE Module: FSC-BT616V
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