2. Identification Mark
3. Soldering terminal
1. Surface Mounted Devices with a small dimension of 5.2 x 2.0 x 1.1 mm meet future miniaturization trend.
2. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product.
3. High Stability in Temperature / Humidity Change