Features
- Qualified Bluetooth v5.1 specifications
- 120 MHz Qualcomm Kalimba™ audio DSP
- 32 MHz Developer Processor for applications
- Firmware Processor for system
- Flexible QSPI flash programmable platform
- Advanced audio algorithms
- High-performance 24‑bit stereo audio interface
- Digital and analog microphone interfaces
- SBC and AAC audio codecs support
- Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
Applications
- TWS Earbuds
- Automotive Audio
- Home Audio
- Bluetooth Speakers
- Multimedia Players
- Wired/Wireless Stereo Headsets/Headphones
Specifications
Bluetooth Audio Module | FSC-BT1026C |
---|---|
Chipset | Qualcomm QCC3024 |
Bluetooth Version | Bluetooth 5.1 (Bluetooth Low Energy, Bluetooth Classic, Dual-mode Bluetooth) |
Dimensions (mm) | 13 × 26.9 × 2.2 |
Transmit Power | +9 dBm |
Profiles | A2DP, AVRCP, HFP, HSP, PBAP, SPP, GATT |
Certification | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
Frequency | 2.402 GHz to 2.480 GHz |
Audio code | SBC and AAC |
Work Temperature | -40 °C to +85 °C |
Firmware
Firmware No. | Application | Profiles |
---|---|---|
FSC-BT1026C | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
FSC-BT1026C | Audio (TWS) & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
FSC-BT1026C | Audio & Data | Customization |