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FSC-BT1026C QCC3024 Bluetooth 5.1 TWS Audio Receiver Module

FSC-BT1026C is a dual-mode Bluetooth 5.1 stereo audio SoC module based on the Qualcomm QCC3024 chipset which features high-performance programmable Bluetooth stereo audio SoC, fully qualified single-chip dual-mode Bluetooth v5.1 system, and tri-core processor architecture with low power for extended battery life. The FSC-BT1026C Bluetooth audio module supports A2DP, AVRCP, HFP, HSP, SPP, GATT, HOGP, and PBAP profiles, and supports SBC and AAC audio codecs for high-end audio applications such as Bluetooth stereo headsets.

$5.90

Features

  • Qualified Bluetooth® v5.1 specification
  • 120MHz Qualcomm® Kalimba™ audio DSP
  • 32MHz developer processor for applications
  • Firmware Processor for system
  • Flexible QSPI flash programmable platform
  • High-performance 24‑bit stereo audio interface
  • Digital and analog microphone interfaces
  • Flexible PIO controller and LED pins with PWM support
  • Supports UART, Bit Serializer (I²C/SPI), and USB 2.0 serial interfaces
  • Advanced audio algorithms
  • 1 or 2-mic Qualcomm@ cVc™ headset noise reduction and echo cancellation technology
  • Supports Qualcomm@ broadcast audio technology technology
  • Supports SBC and AAC audio codecs
  • Integrated PMU with dual SMPS for system/digital circuits and integrated Li-ion battery charger

Applications

  • Bluetooth Stereo Headsets

Specifications

Bluetooth Audio Module FSC-BT1026C
Chipset Qualcomm QCC3024
Bluetooth Standard Dual-mode Bluetooth 5.1
Size (mm) 13 × 26.9 × 2.2
Transmit Output Power +9 dBm (Max.)
Profiles A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT
Certification CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC
Frequency Band 2.402~2.480GHz
Audio Codecs SBC, AAC
Operating Temperature -40 °C to +85 °C
Storage Temperature -40 °C to +85 °C

Firmware

Firmware No. Application Profiles
FSC-BT1026C Audio & Data HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA
FSC-BT1026C Audio (TWS) & Data HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA
FSC-BT1026C Audio & Data Customization
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